Method of fabricating SRAM device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S184000, C438S230000, C438S595000

Reexamination Certificate

active

11027826

ABSTRACT:
A method of fabricating an SRAM device is provided, by which a junction node area is stably secured in a 1T type SRAM device. The method includes forming first and second conductor patterns on a cell area of a semiconductor substrate and a third conductor pattern on a periphery area of the semiconductor substrate, stacking first to third insulating layers over the substrate, forming a spacer on a sidewall of the third conductor pattern in the exposed periphery area, removing the third insulating layer, and forming first and second spacers on sidewalls of the first and second conductor patterns.

REFERENCES:
patent: 6743717 (2004-06-01), Wu et al.
patent: 2002/0113295 (2002-08-01), Nakamura
patent: 2004/0185671 (2004-09-01), Lee

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of fabricating SRAM device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating SRAM device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating SRAM device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3797186

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.