Bottom heat spreader

Details Bottom heat spreader Bottom heat spreader

2007-03-13

2007-03-13

Owens, Douglas W. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S706000, C257S712000, C257S713000, C257S720000, C438S122000, C438S125000

Reexamination Certificate

active

10877586

ABSTRACT:
Embodiments of the invention provide a microelectronic device having a heat spreader positioned between a chip and substrate to which the chip is electrically connected. For one embodiment of the invention, the heat spreader is a thermal slug having a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the chip.

REFERENCES:
patent: 5777385 (1998-07-01), Wu
patent: 5818107 (1998-10-01), Pierson et al.
patent: 5905299 (1999-05-01), Lacap
patent: 5953589 (1999-09-01), Shim et al.
patent: 6191477 (2001-02-01), Hashemi
patent: 6265771 (2001-07-01), Ference et al.
patent: 6809416 (2004-10-01), Sharma
patent: 2002/0135065 (2002-09-01), Zhao et al.
patent: 2003/0057534 (2003-03-01), Ho et al.
patent: 2003/0146506 (2003-08-01), Khan et al.
patent: 2004/0051170 (2004-03-01), Kawakami et al.
International Search Report PCT/US2005/022149.

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