Method for printing contacts on a substrate

Semiconductor device manufacturing: process – Chemical etching

Reexamination Certificate

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Details

C438S711000, C438S745000

Reexamination Certificate

active

11270400

ABSTRACT:
A method for printing contacts utilizes photolithographic pattern reversal. A negative of the contact is printed on a resist layer. Unexposed portions of the resist layer are stripped to expose a first layer. The first layer is etched to remove exposed portions of the first layer not covered by the negative of the contact and to expose a second layer. A pattern reversal is performed to cure exposed portions of the second layer not covered by the first layer.

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patent: WO97/40526 (1997-10-01), None

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