Semiconductor element including a wet prevention film

Details Semiconductor element including a wet prevention film Semiconductor element including a wet prevention film

2007-09-11

2007-09-11

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257SE23023, C257SE23068, C257SE23125, C257SE25013, C257SE23021, C257SE23020, C257SE23024, C257S734000, C257S737000, C257S738000, C257S779000, C257S772000, C361S779000, C228S180220, C228S179100

Reexamination Certificate

active

11271819

ABSTRACT:
A columnar bump formed of copper etc. is formed on a wiring film of a semiconductor chip through an interconnected film and an adhesive film in a wafer unit by electrolytic plating in which package formation is possible. An oxidation prevention film is formed of such as gold on an upper surface or a part of the upper surface and side surface. A wet prevention film of such as an oxide film is formed on the columnar bump side as needed. If this bump is soldered to the pad on a packaging substrate, solder gets wet in the whole region of the columnar bump upper surface and only a part of the side surface. Stabilized and reliable junction form can be thus formed. Moreover, since the columnar bump does not fuse, the distance between a semiconductor board and a packaging board is not be narrowed by solder.

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