Wafer level semiconductor component having thinned,...

Details Wafer level semiconductor component having thinned,... Wafer level semiconductor component having thinned,...

2007-05-22

2007-05-22

Lewis, Monica (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S774000

Reexamination Certificate

active

11052378

ABSTRACT:
A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

REFERENCES:
patent: 5138434 (1992-08-01), Wood et al.
patent: 5436203 (1995-07-01), Lin
patent: 5686317 (1997-11-01), Akram et al.
patent: 5789307 (1998-08-01), Igel et al.
patent: 5851911 (1998-12-01), Farnworth
patent: 5863813 (1999-01-01), Dando
patent: 5888883 (1999-03-01), Sasaki et al.
patent: 5897337 (1999-04-01), Kata et al.
patent: 5904546 (1999-05-01), Wood et al.
patent: 6013948 (2000-01-01), Akram et al.
patent: 6051875 (2000-04-01), Dando
patent: 6054772 (2000-04-01), Mostafazadeh et al.
patent: 6060373 (2000-05-01), Saitoh
patent: 6074896 (2000-06-01), Dando
patent: 6080602 (2000-06-01), Tani et al.
patent: 6087845 (2000-07-01), Wood et al.
patent: 6097087 (2000-08-01), Farnworth et al.
patent: 6107109 (2000-08-01), Akram et al.
patent: 6107164 (2000-08-01), Ohuchi
patent: 6114240 (2000-09-01), Akram et al.
patent: 6130111 (2000-10-01), Ikuina et al.
patent: 6136137 (2000-10-01), Farnworth et al.
patent: 6150717 (2000-11-01), Wood et al.
patent: 6153448 (2000-11-01), Takahashi et al.
patent: 6169329 (2001-01-01), Farnworth et al.
patent: 6177295 (2001-01-01), De Samber et al.
patent: 6180504 (2001-01-01), Farnworth et al.
patent: 6221751 (2001-04-01), Chen et al.
patent: 6228678 (2001-05-01), Gilleo et al.
patent: 6233185 (2001-05-01), Beffa et al.
patent: 6281131 (2001-08-01), Gilton et al.
patent: 6294837 (2001-09-01), Akram et al.
patent: 6313531 (2001-11-01), Geusic et al.
patent: 6313651 (2001-11-01), Hembree et al.
patent: 6326698 (2001-12-01), Akram
patent: 6338980 (2002-01-01), Satoh
patent: 6350664 (2002-02-01), Haji et al.
patent: 6353267 (2002-03-01), Ohuchi et al.
patent: 6451624 (2002-09-01), Farnworth et al.
patent: 6524890 (2003-02-01), Ueda et al.
patent: 6534387 (2003-03-01), Shinogi et al.
patent: 6544821 (2003-04-01), Akram
patent: 6544902 (2003-04-01), Farnworth
patent: 6549821 (2003-04-01), Farnworth et al.
patent: 6573156 (2003-06-01), Wang et al.
patent: 6579748 (2003-06-01), Okuno et al.
patent: 6607970 (2003-08-01), Wakabayashi
patent: 6620731 (2003-09-01), Farnworth et al.
patent: 6649445 (2003-11-01), Qi et al.
patent: 6717245 (2004-04-01), Kinsman et al.
patent: 6774659 (2004-08-01), Chiang
patent: 6841413 (2005-01-01), Liu et al.
patent: 6908784 (2005-06-01), Farnworth et al.
patent: 2001/0040117 (2001-11-01), Easton
patent: 2002/0009826 (2002-01-01), Chien
patent: 2002/0097302 (2002-07-01), Nikkel
patent: 2006/0118953 (2006-06-01), Farnworth et al.
Advanced Coating Parylene Conformal Coating Specialists, advertising material, pp. 1-7, 1998.
Dexter Electronic Materials, Hysol FP 4451 Material Properties, spec sheet, pp. 1-2, Aug. 20, 1999.
Dexter Electronic Materials, Hysol FP 4450 Material Properties, spec sheet, pp. 1-2, Aug. 20, 1999.
Parylene Coating, advertising for Specialty Coating Systems, pp. 1-2, date unknown.
“Wafer size CSP Packaging by VPES”, Japan Rec Co., Ltd., advertising material, pp. 1-4, 1998.
David Francis & Linda Jardine, “Thin, Wafer-Level Package Is Made Without Damaging Die”, Chip Scale Review, May/Jun. 2002, p. 70.
Jeffrey C. Demmin, “More Wafer Thinning at ICAPS”, media news analysis, Mar. 13, 2002.

Affiliated with

Also associated with

Rating

Wafer level semiconductor component having thinned,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer level semiconductor component having thinned,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer level semiconductor component having thinned,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3785261