Methods and apparatus for disposing a thermal interface...

Details Methods and apparatus for disposing a thermal interface... Methods and apparatus for disposing a thermal interface...

2007-04-10

2007-04-10

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE21499

Reexamination Certificate

active

10882511

ABSTRACT:
A microelectronic package and a method of forming the same comprising a microelectronic device attached by an active surface to a substrate. A heat dissipation device having a base portion is positioned over a back surface of the microelectronic device and having at least one lip portion extending from the base portion which is attached to the substrate. An inlet extends through the heat dissipation device base portion and is positioned to be over the microelectronic device back surface. A thermal interface material is dispensed through the inlet and by capillary action is drawn between the microelectronic device back surface and the heat dissipation device base portion.

REFERENCES:
patent: 5608262 (1997-03-01), Degani et al.
patent: 5796582 (1998-08-01), Katchmar
patent: 6015722 (2000-01-01), Banks et al.
patent: 6016006 (2000-01-01), Kolman et al.
patent: 6117382 (2000-09-01), Thummel
patent: 6552906 (2003-04-01), Kanada
patent: 6767765 (2004-07-01), Chiu

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