Electronic circuit unit and method of fabricating the same

Details Electronic circuit unit and method of fabricating the same Electronic circuit unit and method of fabricating the same

2007-01-02

2007-01-02

Ha, Nathan W. (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S777000

Reexamination Certificate

active

11020618

ABSTRACT:
An electronic circuit unit contains electrodes to which bumps of a semiconductor chip are adhered. The electrodes are arranged on an upper surface of a circuit board. Land units to which chip parts is soldered are arranged on a rear surface of the circuit board. such that an insulating plate which is on the rear surface of the circuit board is supported by a supporting jig during a mounting process of the semiconductor chip, and the circuit board is not tilted. Therefore, an electronic circuit unit ensuring that the semiconductor chip is mounted with a reliable mounting capability can be obtained.

REFERENCES:
patent: 6097089 (2000-08-01), Gaku et al.
patent: 6222246 (2001-04-01), Mak et al.
patent: 6278180 (2001-08-01), Mizushima et al.
patent: 6838775 (2005-01-01), Takahashi
patent: 6952049 (2005-10-01), Ogawa et al.
patent: 2003/0038366 (2003-02-01), Kozono
patent: 2004/0021218 (2004-02-01), Hayama et al.
patent: 2004/0022038 (2004-02-01), Figueroa et al.
patent: 2005/0230812 (2005-10-01), Przadka
patent: 2000-307212 (2000-11-01), None

Affiliated with

Also associated with

Rating

Electronic circuit unit and method of fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic circuit unit and method of fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic circuit unit and method of fabricating the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3779728