Thermoplastic fluxing underfill composition and method

Details Thermoplastic fluxing underfill composition and method Thermoplastic fluxing underfill composition and method

2007-01-23

2007-01-23

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

10458925

ABSTRACT:
A flip chip having solder bumps and an underfill that is thermoplastic and fluxing, as well as methods for making such a device. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes.

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