Integrated circuit with bulk and SOI devices connected with...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S374000, C257S509000, C257S347000, C257S513000

Reexamination Certificate

active

10711844

ABSTRACT:
An integrated circuit having devices fabricated in both SOI regions and bulk regions, wherein the regions are connected by a trench filled with epitaxially deposited material. The filled trench provides a continuous semiconductor surface joining the SOI and bulk regions. The SOI and bulk regions may have the same or different crystal orientations. The present integrated circuit is made by forming a substrate with SOI and bulk regions separated by an embedded sidewall spacer (made of dielectric). The sidewall spacer is etched, forming a trench that is subsequently filled with epitaxial material. After planarizing, the substrate has SOI and bulk regions with a continuous semiconductor surface. A butted P-N junction and silicide layer can provide electrical connection between the SOI and bulk regions.

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Chan et al.; “On the Integration of CMOS with Hybrid Crystal Orientations”; 2004 Symposium on VLSI Technology, Digest of Technical Papers; pp. 160-161.

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