Semiconductor device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S410000, C257SE29132, C257SE29165, C438S216000, C438S261000, C438S287000, C438S591000

Reexamination Certificate

active

11197593

ABSTRACT:
According to an aspect of the present invention, there is disclosed a semiconductor device comprising a semiconductor substrate, and a gate insulating film of a P-channel MOS transistor, formed on the semiconductor substrate. The gate insulating film has an oxide film (SiO2), and a diffusion preventive film (BN) containing boron and nitrogen atoms.

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patent: 59-207811 (1984-11-01), None
Matsushita, D. et al., “Atomic-Scale Characterization of Nitridation Processes on Si(100)-2+1 Surfaces by Radical Nitrogen,” Jpn. J. Appl. Phys. vol. 40, Pt. 1, No. 4B, pp. 2827-2829, (Apr. 2001).
D. Matsushita et al., “Novel Fabrication Process to Realize Ultra-thin (EOT 0.7nm) and Ultra-low Leakage SiON Gate Dielectrics,” Symposium on VLSI Technology (2004), pp. 172-173.
H. Yang et al., “Nanostructures of the turbostratic BN transition layer in cubic BN thin films deposited by low-pressure inductively coupled plasma-enhanced chemical vapor deposition,” Journal of Applied Physics (May 15, 2002), 91:6695-99.
Z. Wang et al., “Effect of Polysilicon Gate Type on the Flatband Voltage Shift for Ultrathin Oxide-Nitride Gate Stacks,” IEEE Electron Device Letters (Apr. 2000), 21:170-172.

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