Chuck for supporting wafers with a fluid

Details Chuck for supporting wafers with a fluid Chuck for supporting wafers with a fluid

2007-01-09

2007-01-09

Hiteshew, Felisa (Department: 1722)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S460000, C438S748000, C438S977000

Reexamination Certificate

active

10860381

ABSTRACT:
A method of relieving surface stress on a thin wafer by removing a small portion of the wafer substrate, the substrate being removed by applying a warm solution of KOH to the backside of the wafer while the wafer spins. The wafer may be supported on a rotatable platform adapted to direct the flow of chilled, deionized water underneath the device side of the wafer. The chilled water supports the wafer and protects the devices built-up on the wafer from the corrosive effects of KOH and from thermal damage.

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