Method for reducing warpage during application and curing of...

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article

Reexamination Certificate

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Details

C264S272150, C264S275000, C425S121000, C425S123000

Reexamination Certificate

active

11011624

ABSTRACT:
A method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies, or the like, on printed circuit boards using a clamping fixture assembly, which includes at least one clamping fixture support and at least one clamping fixture overlay. If desired, a plurality of printed circuit boards may be processed using an appropriate clamping fixture assembly. Furthermore, the clamping fixture maybe constructed so a slight bow or curvature thereof can counter either a convex or concave bow or curvature of the printed circuit board.

REFERENCES:
patent: 1750369 (1930-03-01), Septer
patent: 3614540 (1971-10-01), Slusser
patent: 3930644 (1976-01-01), Albert, Jr.
patent: 4339407 (1982-07-01), Leighton
patent: 4463636 (1984-08-01), Heller et al.
patent: 4510008 (1985-04-01), Hoshi et al.
patent: 4554613 (1985-11-01), Kaufman
patent: 4701999 (1987-10-01), Palmer
patent: 4763782 (1988-08-01), Sinchok
patent: 4805316 (1989-02-01), Curti
patent: 4842412 (1989-06-01), Miyake
patent: 4943334 (1990-07-01), Medney et al.
patent: 4948108 (1990-08-01), Sullivan
patent: 4953061 (1990-08-01), Nitkiewicz
patent: 5037691 (1991-08-01), Medney et al.
patent: 5052338 (1991-10-01), Maiorca et al.
patent: 5110615 (1992-05-01), Maiorca et al.
patent: 5111935 (1992-05-01), Bond et al.
patent: 5148962 (1992-09-01), Jones et al.
patent: 5156983 (1992-10-01), Schlesinger et al.
patent: 5271953 (1993-12-01), Litteral
patent: 5298464 (1994-03-01), Schlesinger et al.
patent: 5350455 (1994-09-01), Mahler
patent: RE34794 (1994-11-01), Farnworth
patent: 5376326 (1994-12-01), Medney et al.
patent: 5444304 (1995-08-01), Hara et al.
patent: 5450289 (1995-09-01), Kweon et al.
patent: 5451815 (1995-09-01), Taniguchi et al.
patent: 5456402 (1995-10-01), Curtin
patent: 5492866 (1996-02-01), Nishikawa
patent: 5501436 (1996-03-01), Miller
patent: 5635760 (1997-06-01), Ishikawa
patent: 5653020 (1997-08-01), Romano et al.
patent: 5820013 (1998-10-01), Ortiz
patent: 5868887 (1999-02-01), Sylvester et al.
patent: 6027590 (2000-02-01), Sylvester et al.
patent: 6122170 (2000-09-01), Hirose et al.
patent: 6164636 (2000-12-01), Taylor
patent: 6174482 (2001-01-01), Reames et al.
patent: 6206352 (2001-03-01), Ishitani et al.
patent: 6224936 (2001-05-01), Gochnour et al.
patent: 6237832 (2001-05-01), Chung
patent: 6527999 (2003-03-01), Gochnour et al.
patent: 6592670 (2003-07-01), Gochnour et al.
patent: 6764549 (2004-07-01), Gochnour et al.
patent: 6830719 (2004-12-01), Gochnour et al.
patent: 2005/0087909 (2005-04-01), Gochnour et al.
patent: 57-8050 (1982-01-01), None

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