Method of manufacturing a semiconductor device with a...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S149000, C438S166000, C257SE21324

Reexamination Certificate

active

11042352

ABSTRACT:
At present, a forming process of a base film through an amorphous silicon film is conducted in respective film forming chambers in order to obtain satisfactory films. When continuous formation of the base film through the amorphous silicon film is performed in a single film forming chamber with the above film formation condition, crystallization is not sufficiently attained in a crystallization process. By forming the amorphous silicon film using silane gas diluted with hydrogen, crystallization is sufficiently attained in the crystallization process even with the continuous formation of the base film through the amorphous silicon film in the single film forming chamber.

REFERENCES:
patent: 4441973 (1984-04-01), Noguchi
patent: 4569697 (1986-02-01), Tsu et al.
patent: 4634601 (1987-01-01), Hamakawa et al.
patent: 5296258 (1994-03-01), Tay et al.
patent: 5326723 (1994-07-01), Petro et al.
patent: 5391410 (1995-02-01), Nii et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5650013 (1997-07-01), Yamazaki
patent: 5766344 (1998-06-01), Zhang et al.
patent: 5821138 (1998-10-01), Yamazaki et al.
patent: 5843225 (1998-12-01), Takayama et al.
patent: 5858823 (1999-01-01), Yamazaki et al.
patent: 5923962 (1999-07-01), Ohtani et al.
patent: 5938839 (1999-08-01), Zhang
patent: 5942050 (1999-08-01), Green et al.
patent: 5953597 (1999-09-01), Kusumoto et al.
patent: 5968279 (1999-10-01), MacLeish et al.
patent: 5985704 (1999-11-01), Adachi et al.
patent: 6020035 (2000-02-01), Gupta et al.
patent: 6033973 (2000-03-01), Takemura
patent: 6087679 (2000-07-01), Yamazaki et al.
patent: 6107639 (2000-08-01), Yamazaki et al.
patent: 6156627 (2000-12-01), Zhang et al.
patent: 6162667 (2000-12-01), Funai et al.
patent: 6177302 (2001-01-01), Yamazaki et al.
patent: 6180438 (2001-01-01), Deane et al.
patent: 6204099 (2001-03-01), Kusumoto et al.
patent: 6221701 (2001-04-01), Yamazaki
patent: 6261877 (2001-07-01), Yamazaki et al.
patent: 6265745 (2001-07-01), Kusumoto et al.
patent: 6361912 (2002-03-01), Fonash et al.
patent: 6375756 (2002-04-01), Ishibashi
patent: 6376333 (2002-04-01), Yamazaki et al.
patent: 6468927 (2002-10-01), Zhang et al.
patent: 6541354 (2003-04-01), Shimoda et al.
patent: 6657376 (2003-12-01), Raina et al.
patent: 6758224 (2004-07-01), Nogami
patent: 6767836 (2004-07-01), San et al.
patent: 6784957 (2004-08-01), Kanou et al.
patent: 6872323 (2005-03-01), Entley et al.
patent: 6903025 (2005-06-01), Mizushima
patent: 2003/0143410 (2003-07-01), Won et al.
patent: 06-232059 (1994-08-01), None
patent: 07-130652 (1995-05-01), None
Specification, claims and drawings of U.S. Appl. No. 08/823,608, filed Mar. 24, 1997 (now abandoned).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a semiconductor device with a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a semiconductor device with a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a semiconductor device with a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3775163

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.