Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-01-23
2007-01-23
Picardat, Kevin M. (Department: 2822)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S617000
Reexamination Certificate
active
11114977
ABSTRACT:
A method of electrically connecting a wiring member to a plurality of electrodes which respectively correspond to a plurality of recording elements of a recording head, the wiring member including a plurality of wire portions and a plurality of terminal portions each of which is connected to the corresponding wire portion, the method including: forming convex bumps by using a conductive solder, respectively on the plurality of terminal portions; and connecting the plurality of terminal portions and the plurality of electrodes respectively to one another via the respective convex bumps by heating and melting the convex bumps at a predetermined temperature with the convex bumps pressed respectively onto the plurality of electrodes with a predetermined load, wherein the connecting the plurality of terminal portions and the plurality of electrodes is carried out such that the predetermined load and the predetermined temperature are decreased with an increase in a height of the convex bumps.
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Imai Koji
Shinkai Yuji
Brother Kogyo Kabushiki Kaisha
Picardat Kevin M.
Reed Smith LLP
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