Solder ball assembly for a semiconductor device and method...

Details Solder ball assembly for a semiconductor device and method... Solder ball assembly for a semiconductor device and method...

2007-07-10

2007-07-10

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S064000, C438S612000, C257SE21008, C257S508000, C257SE23007, C257S069000

Reexamination Certificate

active

11053510

ABSTRACT:
Solder ball assembly for a semiconductor device and method of fabricating the same is described. In one example, a solder mask is formed on a substrate having an aperture exposing at least a portion of a conductive pad of the substrate. A solder pillar is formed in the aperture and in electrical communication with the conductive pad. An insulating layer is formed on the solder mask exposing at least a portion of the solder pillar. The exposed portion of the solder pillar is removed to define a mounting surface. A solder ball is formed on the mounting surface in electrical communication with the solder pillar. The solder pillar may include high-temperature solder having a melting point higher than that of the solder ball.

REFERENCES:
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patent: 6130479 (2000-10-01), Chalco et al.
patent: 6180265 (2001-01-01), Erickson
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patent: 6306751 (2001-10-01), Patel et al.
patent: 6485843 (2002-11-01), Eslamy
patent: 6583040 (2003-06-01), Lin
patent: 6673710 (2004-01-01), Lin
patent: 6762503 (2004-07-01), Lee
patent: 6940179 (2005-09-01), Lee

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