Semiconductor device having a low dielectric constant film...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S900000, C438S300000

Reexamination Certificate

active

10157908

ABSTRACT:
A semiconductor device has a structure that reduces the parasitic capacitance by using a film with a low relative dielectric constant as the side wall material of the gate. The material with a low relative dielectric constant is preferably a material whose relative dielectric constant is less than the relative dielectric constant of an oxide film, i.e., less than about 3.9.

REFERENCES:
patent: 6121671 (2000-09-01), Ko et al.
patent: 6127711 (2000-10-01), Ono
patent: 6307230 (2001-10-01), Chatterjee et al.
patent: 6372589 (2002-04-01), Yu
patent: 6406945 (2002-06-01), Lee et al.
patent: 6458661 (2002-10-01), Sung
patent: 6518631 (2003-02-01), En et al.
patent: 2003/0038305 (2003-02-01), Wasshuber
patent: 7-22338 (1995-01-01), None
Size, S.M., Physics of Semiconductor devices, 2ndEd., p. 852.
J.M. Sung et al.; Flourine Effect on Boron Diffusion of P+ Gate Devices; 17.2.1 - 12.2.4.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device having a low dielectric constant film... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having a low dielectric constant film..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having a low dielectric constant film... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3765874

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.