Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate
2007-05-08
2007-05-08
Lebentritt, Michael (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
C257S676000, C257S700000, C257S787000, C257SE23037, C257SE23069
Reexamination Certificate
active
10220752
ABSTRACT:
A device for and method of packaging electronic components (1) using injection-molding. For this purpose, a multiplicity of components (1) are arranged in predetermined positions on a first side (2) of a leadframe (3). The leadframe (3) has interconnects (5) with contact terminal areas (6) for connecting to contact areas (7) of the electronic components (1) and contact vias (8) to external contacts on a second side (10) of the leadframe (3). In this case, the leadframe (3) includes a ceramic substrate (11) with a first side (2) having edge regions (12) configured with a ductile, annular metal layer (13).
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Bast Ulrich
Ernst Georg
Oechsner Matthias
Zeiler Thomas
Greensberg Laurence A.
Lebentritt Michael
Pompey Ron
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