Semiconductor device with multi-layered wiring arrangement...

Details Semiconductor device with multi-layered wiring arrangement... Semiconductor device with multi-layered wiring arrangement...

2007-04-03

2007-04-03

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S014000

Reexamination Certificate

active

10981679

ABSTRACT:
A semiconductor device includes a semiconductor substrate having electronic elements produced therein, and an insulating underlayer formed thereon, and a multi-layered wiring arrangement constructed on the insulating underlayer semiconductor substrate. The multi-layered wiring arrangement includes a first insulating interlayer structure formed on the insulating underlayer, a second insulating interlayer structure, and a third insulating interlayer structure formed on the first insulating interlayer structure. Each of the first, second and third insulating interlayer structures includes a low-k insulating layer, and has a reinforcing element formed therein. The second insulating interlayer structure has a joint plug formed therein. The reinforcing elements of the first and third insulating interlayer structures are connected to each other through the joint plug.

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patent: 2001-168093 (2001-06-01), None
patent: 2003-031611 (2003-01-01), None

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