Interconnect speed sensing circuitry

Details Interconnect speed sensing circuitry Interconnect speed sensing circuitry

2007-03-27

2007-03-27

Siek, Vuthe (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000

Reexamination Certificate

active

10700902

ABSTRACT:
A mechanism has been developed by which the impact on speed from back end-of-line interconnect layers may be characterized. A method for designing interconnect layers of an integrated circuit includes coupling a capacitive load to a speed sensing circuit to measure a delay corresponding to an interconnect structure of an integrated circuit design, selectively configuring the capacitive load by selectively coupling at least one of a plurality of capacitive structures, the capacitive structures including at least a portion of a plurality of metal layers. The capacitive load is representative of the interconnect structure. The method includes measuring the delay corresponding to the capacitive load to characterize at least one layer of the interconnect structure. In some realizations, the method also includes characterizing the interconnect structure based at least in part on the delay measurement.

REFERENCES:
patent: 5943488 (1999-08-01), Raza
patent: 6207553 (2001-03-01), Buynoski et al.
patent: 6345209 (2002-02-01), Yu
patent: 6463570 (2002-10-01), Dunn et al.
patent: 6493851 (2002-12-01), Bach et al.
patent: 6553545 (2003-04-01), Stinson et al.
patent: 6560567 (2003-05-01), Yechuri
patent: 2002/0032493 (2002-03-01), Kadowaki et al.
patent: 2005/0097485 (2005-05-01), Guenthner et al.
Stopper, H “A Wafer with Electrically Programmable Interconnections”, Digest of Technical papers, 1985 IEEE International Solid-State Circuits Conference, Feb. 1985, pp. 268-269.
Neil H. E. Weste and Kamran Eshraghian, Principles of CMOS VLSI Design, A Systems Perspective, Second Edition, Addison-Wesley Publishing Co., Copyright 1993 by AT&T, pp. 191-198.
Tom Pye and Peter Rose, Low-Dielectric-Constant Materials for Back-End-of-Line Applications, Semiconductor Fabtech, 8thEdition, pp. 203-207.

Affiliated with

Also associated with

Rating

Interconnect speed sensing circuitry does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnect speed sensing circuitry, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnect speed sensing circuitry will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3756523