Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2007-03-13
2007-03-13
Parker, Kenneth (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S758000, C257S762000, C438S669000, C438S652000
Reexamination Certificate
active
11265302
ABSTRACT:
Patterned copper structures are fabricated by selectively capping the copper employing selective etching and/or selective electroplating in the presence of a liner material. Apparatus for addressing the problem of an increased resistive path as electrolyte during electroetching and/or electroplating flows from the wafer edge inwards is provided.
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Andricacos Panayotis C.
Chen Shyng-Tsong
Cotte John M.
Deligianni Hariklia
Krishnan Mahadevaiyer
Chu Chris C.
Connolly Bove & Lodge & Hutz LLP
Parker Kenneth
Trepp Robert
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