Photosensitive resin film and cured film made therefrom

Details Photosensitive resin film and cured film made therefrom Photosensitive resin film and cured film made therefrom

2007-05-08

2007-05-08

Hamilton, Cynthia (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S285100, C430S288100, C430S910000, C430S920000, C430S923000, C430S018000

Reexamination Certificate

active

10551447

ABSTRACT:
The photosensitive resin film in an uncured state of the invention comprises (A) a specific alkali-soluble copolymer, (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator by the use of which a coating film having a dry film thickness of 70 μm in an uncured state has a 365 nm radiation transmittance of not less than 10% and a 405 nm radiation transmittance of not less than 60%, contains the radiation-sensitive radical polymerization initiator (C) in an amount of 20 to 40 parts by weight based on 100 parts by weight of the component (A), and has a dry film thickness of not less than 50 μm. According to the photosensitive resin film, a high bump having a height of not less than 50 μm can be readily formed on a chip substrate with high precision though formation of such a high bump is difficult by the conventional technique. Moreover, connection failure of an element can be inhibited, and reliability of an element can be enhanced.

REFERENCES:
patent: 4935320 (1990-06-01), Rohde et al.
patent: 5217847 (1993-06-01), Varnell
patent: 6312867 (2001-11-01), Kinsho et al.
patent: 6338936 (2002-01-01), Ichikawa et al.
patent: 03-188150 (1991-08-01), None
patent: 11-271974 (1999-10-01), None
patent: 2000-39709 (2000-02-01), None
patent: 2000-336121 (2000-12-01), None
patent: 2002-182381 (2002-06-01), None
patent: 2003-29604 (2003-01-01), None
patent: 2003-113174 (2003-04-01), None
2003-29604, Jan. 31, 2003, JP (English abstract only), no document.
2002-182381 Jun. 26, 2002, JP (English abstract only), no document.
2000-39709, Feb. 8, 2000, JP (English abstract only), no document.
2003-336121, Dec. 5, 2000, JP (English abstract only & Equivalent of US 6312867), no document.
11-271974, Oct. 8, 1999, JP (English abstract only), no document.
3-188150, Aug. 16, 1991, JP (English abstract only & Equivalent of US 5217847), no document.
2003-113174, Apr. 18, 2003, JP (English abstract only), no document.

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