Semiconductor device manufacturing: process – Semiconductor substrate dicing – By electromagnetic irradiation
Reexamination Certificate
2007-03-20
2007-03-20
Ghyka, Alexander (Department: 2812)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
By electromagnetic irradiation
C438S013000, C219S121670, C219S121680, C372S010000, C257SE21596
Reexamination Certificate
active
11125367
ABSTRACT:
A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
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Cordingley James J.
Dowd Roger D.
Ehrmann Jonathan S.
Griffiths Joseph J.
Lee Joohan
Brooks & Kushman P.C.
Ghyka Alexander
GSI Group Corporation
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