Semiconductor component and method of manufacture

Details Semiconductor component and method of manufacture Semiconductor component and method of manufacture

2007-05-29

2007-05-29

Nguyen, Cuong (Department: 2811)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

On insulating substrate or layer

C438S197000, C438S479000, C438S517000

Reexamination Certificate

active

11071375

ABSTRACT:
A semiconductor component having analog and logic circuit elements manufactured from an SOI substrate and a method for manufacturing the semiconductor component. An SOI substrate has a support wafer coupled to an active wafer through an insulating material. Openings are formed in the active wafer, extend through the insulating material, and expose portions of the support wafer. Epitaxial semiconductor material is grown on the exposed portions of the support wafer. Analog circuitry is manufactured from the epitaxially grown semiconductor material and high performance logic circuitry is manufactured from the active wafer. The processing steps for manufacturing the analog circuitry are decoupled from the steps for manufacturing the high performance logic circuitry. A substrate contact is made from a portion of the epitaxially grown semiconductor material that is electrically isolated from the portion in which the analog circuitry is manufactured.

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