Plastic materials including dendrimers or hyperbranched...

Details Plastic materials including dendrimers or hyperbranched... Plastic materials including dendrimers or hyperbranched...

2007-05-29

2007-05-29

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257SE23110, C257S788000, C257S787000, C257S632000, C257S642000, C257S792000, C525S474000, C525S437000, C525S452000, C525S450000, C430S270100, C430S927000, C430S311000, C430S327000, C430S315000

Reexamination Certificate

active

11138203

ABSTRACT:
Integrated circuit packages and their manufacture are described, wherein the packages comprise dendrimers or hyperbranched polymers. In some implementations, the dendrimers or hyperbranched polymers include repeat units having one or more ring structures and having surface groups to react with one or more components of a plastic. In some implementations, the dendrimers or hyperbranched polymers have a glass transition temperature of less than an operating temperature of the integrated circuit and form at least a partially separate phase.

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patent: 2006/0105181 (2006-05-01), Lin et al.

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