System and method to increase die stand-off height

Details System and method to increase die stand-off height System and method to increase die stand-off height

2007-05-29

2007-05-29

Le, Thao X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C438S118000, C257SE21503

Reexamination Certificate

active

10444772

ABSTRACT:
In accordance with the present invention, a system and method to increase die stand-off height in a flip chip are provided. The system includes a plurality of separator pedestals disposed between a first face of a die and a second face of a substrate, the substrate positioned generally parallel with, and spaced apart from, the die, and the first face being opposite the second face. The plurality of separator pedestals are operable to selectively force the die and substrate apart, increasing the stand-off height of the flip chip assembly.

REFERENCES:
patent: 6053394 (2000-04-01), Dockerty et al.
patent: 6395991 (2002-05-01), Dockerty et al.
patent: 6400009 (2002-06-01), Bishop et al.
patent: 6649444 (2003-11-01), Earnworth et al.
patent: 06-232202 (1994-08-01), None
patent: 2001-313309 (2001-09-01), None

Affiliated with

Also associated with

Rating

System and method to increase die stand-off height does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System and method to increase die stand-off height, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System and method to increase die stand-off height will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3732564