Surface acoustic wave device and method of fabricating the same

Details Surface acoustic wave device and method of fabricating the same Surface acoustic wave device and method of fabricating the same

2007-09-25

2007-09-25

Schuberg, Darren (Department: 2834)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

Reexamination Certificate

active

10812362

ABSTRACT:
A surface acoustic wave device includes, a first substrate, a surface acoustic wave chip attached to the first substrate, and a second substrate that hermetically seals the surface acoustic wave chip. At least one of the first and second substrates includes. The first and second substrates have respective joining surfaces. An electric circuit is formed on a surface area of the first substrate other than the joining surfaces.

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Hideki Takagi, “Room-Temperature Bonding of Silicon Wafers By Means Of The Surface Activation Method”, Report of Mechanical Engineering Laboratory, No. 189, Dec. 2000, 14-pages.

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