Semiconductor device, semiconductor wafer, semiconductor...

Details Semiconductor device, semiconductor wafer, semiconductor... Semiconductor device, semiconductor wafer, semiconductor...

2007-05-15

2007-05-15

Whitehead Jr., Carl (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S669000, C257S787000, C438S033000, C438S068000, C438S113000, C438S114000, C438S117000, C438S465000

Reexamination Certificate

active

10861523

ABSTRACT:
Semiconductor devices,-semiconductor wafers, and semiconductor modules are provided: wherein the semiconductor device has a small warp; damages at chip edge and cracks in a dropping test are scarcely generated; and the semiconductor device is superior in mounting reliability and mass producibility.The semiconductor device17comprising: a semiconductor chip64;a porous stress relaxing layer3provided on the plane, whereon circuits and electrodes are formed, of the semiconductor chip; a circuit layer2provided on the stress relaxing layer and connected to the electrodes; and external terminals10provided on the circuit layer; wherein an organic protecting film7is formed on the plane, opposite to the stress relaxing layer, of the semiconductor chip, and respective side planes of the stress relaxing layer, the semiconductor chip6,and the protecting film7are exposed outside on a same plane.

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