Semiconductor package and method for fabricating the same

Details Semiconductor package and method for fabricating the same Semiconductor package and method for fabricating the same

2007-04-17

2007-04-17

Doan, Theresa T. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S668000

Reexamination Certificate

active

10972200

ABSTRACT:
A semiconductor package and a method for fabricating the same are proposed. A substrate having a first circuit layer, a second circuit layer, and a core layer formed between the first and second circuit layers is provided. At least one second opening is formed on the second circuit layer. At least one first opening is formed on the first circuit layer corresponding to the second opening. A plurality of finger holes corresponding to bond fingers on the first circuit layer are formed in the core layer. A through opening is formed in the core layer and communicates with the first and second openings. At least one chip is mounted on the first circuit layer and covers the first opening, with its active surface being exposed to the first opening. An encapsulant is formed to fill the first and second openings and the through opening and encapsulate the chip.

REFERENCES:
patent: 6218731 (2001-04-01), Huang et al.
patent: 6521980 (2003-02-01), Tandy et al.

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