Process for producing metallic interconnects and contact...

Details Process for producing metallic interconnects and contact... Process for producing metallic interconnects and contact...

Filed on

2007-09-18

Date issued

2007-09-18

Examiner

Fahmy, Wael M. (Department: 2813)

Patent Class

Semiconductor device manufacturing: process

SubClass

Coating with electrically or thermally conductive material

SubSubClass

To form ohmic contact to semiconductive material

Other Related Categories

C438S598000, C438S637000, C438S641000, C438S668000, C438S675000, C438S687000

Type

Reexamination Certificate

Status

active

Patent number

11049615

Description

ABSTRACT:
A process produces metallic interconnects and contact surfaces on electronic components using a copper-nickel-gold layer structure. The copper core of the interconnects and contact surfaces is deposited by electroplating by means of a first resist mask made from positive resist. The copper core of the interconnects and contact surfaces is surrounded by a nickel-gold layer by means of a second resist mask. The interconnects and contact surfaces are produced by means of two resist masks arranged one on top of the other, in such a way that the copper which forms the core of the interconnect is completely surrounded by the nickel-gold layer, which extends above the copper core, and an adjoining layer that extends beneath the copper core and comprises a diffusion barrier and seed layer.

REFERENCES:
patent: 4861425 (1989-08-01), Greer et al.
patent: 5969422 (1999-10-01), Ting et al.
patent: 6663787 (2003-12-01), You et al.
patent: 2003/0092274 (2003-05-01), Brintzinger
patent: 2004/0067604 (2004-04-01), Ouellet et al.
patent: 2005/0186786 (2005-08-01), Brintzinger et al.
patent: 101 56 054 (2003-11-01), None
Wong, K.K.H., et al., “Metallization by plating for high-performance multichip modules,” IBM J. Res. Develop., vol. 42, No. 5, Sep. 1998, pp. 587-596.

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