Impedance matching commonly and independently

Details Impedance matching commonly and independently Impedance matching commonly and independently

2007-03-27

2007-03-27

Cho, James H. (Department: 2819)

Electronic digital logic circuitry

Signal sensitivity or transmission integrity

Bus or line termination

C326S026000

Reexamination Certificate

active

10983723

ABSTRACT:
A semiconductor device is easy for high accuracy impedance matching against differences in impedance of a transmission line and a package wire. A semiconductor chip having external output buffers and a packaging circuit are included. Each external output buffer has a first output portion whose internal impedance is adjusted commonly with other external output buffers in accordance with impedance control data and a second output portion whose internal impedance is adjusted independently of other external output buffers. Both of the first and second output portions are connected in parallel to a common output terminal. Common adjustment by the first output portion can cope with impedance of the transmission line and individual adjustment by the second output portion can cope with a difference of package wires.

REFERENCES:
patent: 6246255 (2001-06-01), Takizawa
patent: 6445245 (2002-09-01), Schultz et al.
patent: 6967500 (2005-11-01), Lin et al.
patent: 05-166931 (1991-12-01), None

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