Method and apparatus for relocating elements in a floorplan...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C716S030000, C716S030000

Reexamination Certificate

active

11021841

ABSTRACT:
A method for modifying a compiled integrated circuit floorplan is provided. A non-optimally placed functional element within the floorplan is identified and then moved to a tray region outside of the integrated circuit floorplan. A location to move the non-optimally placed functional element is identified. In one embodiment, the location to move the non-optimally placed functional element is not viewable in the same display as the original location of the non-optimally placed functional element. The non-optimally placed functional element is then relocated from the tray region to a new location within the floorplan. The modified floorplan may be recompiled upon relocation of the functional element. A computer readable medium, a graphical user interface, and a system for designing an integrated circuit are also provided.

REFERENCES:
patent: 2003/0149962 (2003-08-01), Willis et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for relocating elements in a floorplan... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for relocating elements in a floorplan..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for relocating elements in a floorplan... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3726680

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.