Method of bumping die pads for wafer testing

Details Method of bumping die pads for wafer testing Method of bumping die pads for wafer testing

2007-01-09

2007-01-09

Estrada, Michelle (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S015000, C438S612000, C438S613000, C257S737000, C257SE23021

Reexamination Certificate

active

11121703

ABSTRACT:
A method of processing a semiconductor wafer including a plurality of semiconductor dies is provided. The method includes providing a semiconductor wafer including a plurality of semiconductor dies, at least a portion of the semiconductor dies including contact pads for testing the respective semiconductor die. The method also includes positioning conductive bumps on the contact pads prior to completing wafer testing of the semiconductor wafer and prior to the singulation of the plurality of semiconductor dies from the semiconductor wafer. At least a portion of the conductive bumps are configured to be electrical paths during wafer testing of the semiconductor wafer.

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