Method of forming copper sulfide layer over substrate

Details Method of forming copper sulfide layer over substrate Method of forming copper sulfide layer over substrate

2006-12-12

2006-12-12

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S618000

Reexamination Certificate

active

07148144

ABSTRACT:
Methods of forming copper sulfide regions or layers over a substrate are disclosed. The copper sulfide regions or layers are formed by contacting a sulfide compound with a substrate containing at least copper and contacting a copper vapor precursor with the substrate to form the copper sulfide layer. Methods of making a memory devices/cells containing a copper sulfide layer, methods of using the memory devices/cells, and devices such as computers containing the memory devices/cells are also disclosed.

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