Semiconductor device and method of manufacturing the...

Details Semiconductor device and method of manufacturing the... Semiconductor device and method of manufacturing the...

2006-10-17

2006-10-17

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S737000, C257SE23021, C228S180220

Reexamination Certificate

active

07122897

ABSTRACT:
A semiconductor device comprises a semiconductor chip, a wiring layer formed on the semiconductor chip, a column electrode connected at a first end to the wiring layer, and an encapsulation resin formed on the semiconductor chip. In the semiconductor device, the column electrode is provided with a second end, opposite to the first end, projecting from the encapsulation resin, and an external connection member is connected to the column electrode at the second end so that the external connection member is separate from a surface of the encapsulation resin.

REFERENCES:
patent: 5821626 (1998-10-01), Ouchi et al.
patent: 6159837 (2000-12-01), Yamaji et al.
patent: 6380061 (2002-04-01), Kobayashi et al.
patent: 2001-291733 (2001-10-01), None
patent: 2002-270721 (2002-09-01), None
patent: 1999-024546 (1999-04-01), None
Office Action from Korean Patent Office dated Mar. 24, 2006, in corresponding Korean patent application.

Affiliated with

Also associated with

Rating

Semiconductor device and method of manufacturing the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of manufacturing the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of manufacturing the... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3714474