Electromigration barrier layers for solder joints

Details Electromigration barrier layers for solder joints Electromigration barrier layers for solder joints

2006-10-17

2006-10-17

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S612000, C438S613000, C438S615000, C438S108000

Reexamination Certificate

active

07122460

ABSTRACT:
A microelectronic package is disclosed including a microelectronic device, a substrate, and a signaling path coupling the microelectronic device with the substrate. The signaling path includes a conductive material, a solder joint, and a barrier material disposed between the conductive material and the solder joint. The barrier material may include nickel, cobalt, iron, titanium, and combinations thereof.

REFERENCES:
patent: 5210939 (1993-05-01), Mallik et al.
patent: 5261989 (1993-11-01), Ueltzen
patent: 5420461 (1995-05-01), Mallik et al.
patent: 5506756 (1996-04-01), Haley
patent: 5519580 (1996-05-01), Natarajan et al.
patent: 5707247 (1998-01-01), Konstad
patent: 5751556 (1998-05-01), Butler et al.
patent: 5757071 (1998-05-01), Bhansali
patent: 5787575 (1998-08-01), Banerjee et al.
patent: 5812379 (1998-09-01), Barrow
patent: 5880530 (1999-03-01), Mashimoto et al.
patent: 5883783 (1999-03-01), Turturro
patent: 5889652 (1999-03-01), Turturro
patent: 5889655 (1999-03-01), Barrow
patent: 5893725 (1999-04-01), Bhansali
patent: 5898222 (1999-04-01), Farooq et al.
patent: 5966020 (1999-10-01), Rampone et al.
patent: 6016852 (2000-01-01), Mallik et al.
patent: 6030854 (2000-02-01), Mashimoto et al.
patent: 6031283 (2000-02-01), Banerjee et al.
patent: 6043559 (2000-03-01), Banerjee et al.
patent: 6088915 (2000-07-01), Turturro
patent: 6118182 (2000-09-01), Barrow
patent: 6120885 (2000-09-01), Call et al.
patent: 6177729 (2001-01-01), Benenati et al.
patent: 6206272 (2001-03-01), Waldron-Floyde et al.
patent: 6238948 (2001-05-01), Ramalingam
patent: 6242803 (2001-06-01), Khandros et al.
patent: 6271111 (2001-08-01), Farooq et al.
patent: 6281581 (2001-08-01), Desai et al.
patent: 6307160 (2001-10-01), Mei et al.
patent: 6312830 (2001-11-01), Li et al.
patent: 6331446 (2001-12-01), Cook et al.
patent: 6359372 (2002-03-01), Dujari et al.
patent: 6365500 (2002-04-01), Chang et al.
patent: 6365973 (2002-04-01), Koning
patent: 6413849 (2002-07-01), Yeoh et al.
patent: 6429383 (2002-08-01), Sprietsma et al.
patent: 6440770 (2002-08-01), Banerjee et al.
patent: 6452502 (2002-09-01), Dishongh et al.
patent: 6461954 (2002-10-01), Li et al.
patent: 6489557 (2002-12-01), Eskildsen et al.
patent: 6490166 (2002-12-01), Ramalingam et al.
patent: 6498086 (2002-12-01), Zheng et al.
patent: 6509530 (2003-01-01), Pearson et al.
patent: 6512861 (2003-01-01), Chakravorty et al.
patent: 6521996 (2003-02-01), Seshan
patent: 6528345 (2003-03-01), Cook et al.
patent: 6535386 (2003-03-01), Sathe et al.
patent: 6548386 (2003-04-01), Kondo et al.
patent: 6610591 (2003-08-01), Jiang et al.
patent: 2000-150574 (2000-05-01), None
Riet Labie, et al. “Investigation of Co UBM for Direct Bumping on CU/LowK Dies”, 2003 Electronics Components and Technology Conference. pp. 1230-1234.

Affiliated with

Also associated with

Rating

Electromigration barrier layers for solder joints does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electromigration barrier layers for solder joints, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electromigration barrier layers for solder joints will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3714193