Semiconductor device, process of producing semiconductor...

Details Semiconductor device, process of producing semiconductor... Semiconductor device, process of producing semiconductor...

2006-10-03

2006-10-03

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C257S669000

Reexamination Certificate

active

07115975

ABSTRACT:
When bonding inner leads of a flexible film wiring board to electrode pads of a semiconductor element substrate, by absorbing a stress generated due to a difference in thermal expansion coefficient between the flexible film wiring board and the semiconductor element substrate during cooling after heat-bonding, by a through-hole or recessed groove portion formed in the inner leads, it is possible to prevent peeling off of a bonding portion and improve the reliability.

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