Polymers, resist compositions and patterning process

Details Polymers, resist compositions and patterning process Polymers, resist compositions and patterning process

2006-10-24

2006-10-24

Chu, John S. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S326000, C430S330000, C430S907000, C430S910000, C526S246000, C526S318000

Reexamination Certificate

active

07125643

ABSTRACT:
A polymer comprising recurring units of formula (1) and recurring units of formulae (2a) to (2d) wherein R1is F or fluoroalkyl, R2is a single bond or an alkylene or fluoroalkylene, R3and R4are H, F, alkyl or fluoroalkyl, at least one of R3and R4contains F, R5is H or an acid labile group, R6is an acid labile group, adhesive group, alkyl or fluoroalkyl, and “a” is 1 or 2 is used as a base resin to formulate a resist composition which has advantages including high transparency to radiation having a wavelength of up to 200 nm, substrate adhesion, developer affinity and dry etching resistance.

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SPIE 2001, Proceedings 4345, pp. 273-284, Ito et al. “Polymer design for 157 nm chemically amplified resists”.
SPEI 2002, Proceedings 4690, pp. 76-83, Kodam et al. “Synthesis of Novel Fluoropolymer for 157 nm Photoresists by Cyclo-Polymerization”.

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