Process for manufacturing printed circuit boards

Details Process for manufacturing printed circuit boards Process for manufacturing printed circuit boards

1985-10-03

1988-01-19

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29852, 156656, 1566591, 156902, 427 97, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

047203242

ABSTRACT:
A process for the manufacture of a circuit board containing a circuit utilizing surface mount components is disclosed. In the process, the circuit is built up with conductive material; the surface mount pads are built up with solder material; a solder mask is applied; flux is applied; the surface components are affixed to the pads; and heat is applied to melt a portion of the solder material to affix the surface mount components to the surface mount pads.

REFERENCES:
patent: 4104111 (1978-08-01), Mack
patent: 4211603 (1980-07-01), Reed
patent: 4325780 (1982-04-01), Schulz
patent: 4487654 (1984-12-01), Coppin
Vapor-Phase Soldering Cuts Costs on Wrap-Post Backplane Assembly, An EPP Product Application Report, GTE Lenkurt Inc.
Fluroinert Electronic Liquids for Vapor Phase Reflow Soldering, Commercial Chemicals Division/3M.

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