Method of forming copper wire

Details Method of forming copper wire Method of forming copper wire

2006-12-05

2006-12-05

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21584

Reexamination Certificate

active

07144812

ABSTRACT:
Cu is nitrided to form a nitride of Cu5on a Cu wiring layer1. A diffusion base material layer6used as a diffusion source and a barrier metal layer7, which are interdiffused with Cu, are formed on the nitride of Cu5. With heat treatment, the Cu wiring layer1and the diffusion base material layer6are interdiffused to form an alloy layer of Cu8between the Cu wiring layer1and the barrier metal layer7.

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