Molding apparatus with a molding flowability sensor for...

Details Molding apparatus with a molding flowability sensor for... Molding apparatus with a molding flowability sensor for...

2006-12-05

2006-12-05

Davis, Robert B. (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

With indicator, signal, recorder, illuminator, or inspection...

For molding temperature or pressure

Reexamination Certificate

active

07144239

ABSTRACT:
A molding apparatus mainly comprises a mold chase holder, a mold chase, a heater and a molding flowability sensor. The mold chase comprises a mold cavity and a via, wherein the via penetrates a mold-cavity surface of the mold cavity. The mold chase is accommodated by a mold chase holder and there is a heater, for heating the mold chase up, disposed therein. And the molding flowability sensor for measuring the molding flowability of the instant molding flow at the mold-cavity surface of the mold cavity is provided at the mold-cavity surface of the mold cavity.

REFERENCES:
patent: 4426341 (1984-01-01), Tsuzuku et al.
patent: 6345974 (2002-02-01), Kawasaki et al.
patent: 54097660 (1979-08-01), None
patent: 02122636 (1990-05-01), None
patent: 02163946 (1990-06-01), None
patent: 06053263 (1994-02-01), None
patent: 10256287 (1998-09-01), None
patent: 11176853 (1999-07-01), None
patent: 2002076041 (2002-03-01), None
Dominick Rostao et al, Injection Molding Handbook, 2000, Kluwer Academic Publishers, 3rd edition, pp. 667-682.
Gunter Mennig, Mold-Making Handbook, 1998, Hanser Publishers, 2nd edition, pp. 518-519.

Affiliated with

Also associated with

Rating

Molding apparatus with a molding flowability sensor for... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Molding apparatus with a molding flowability sensor for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Molding apparatus with a molding flowability sensor for... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3701374