Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-10-17
2006-10-17
Flynn, Nathan J. (Department: 2826)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S659000, C438S655000, C257S342000, C257S319000, C257S340000, C257S384000, C257S385000, C257S388000
Reexamination Certificate
active
07122470
ABSTRACT:
A semiconductor device having a gate electrode free from increasing of resistance of the gate electrode, from decreasing of capacitance of the insulation film due to depletion, and from penetrating of impurity. The semiconductor device includes a silicon layer, a gate insulating film formed on the silicon layer, a metal boron compound layer formed on the gate insulating film, and a gate electrode formed on the metal boron compound layer and containing at least silicon.
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C. Hobbs, et al. “Sub-Quarter Micron CMOS Process for TiN-Gate MOSFETs with TiO2Gate Dielectric Formed by Titanium Oxidation” Symposium on VLSI Technology Digest of Technical Papers, 1999, pp. 133-134.
Koyama Masato
Nishiyama Akira
Flynn Nathan J.
Tran Tan
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