Semiconductor device and method of manufacturing the same

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region

Reexamination Certificate

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C438S519000, C438S522000, C438S530000, C257SE21335

Reexamination Certificate

active

07091114

ABSTRACT:
Disclosed is a method for manufacturing a semiconductor device comprising implanting ions of an impurity element into a semiconductor region, implanting, into the semiconductor region, ions of a predetermined element which is a group IV element or an element having the same conductivity type as the impurity element and larger in mass number than the impurity element, and irradiating a region into which the impurity element and the predetermined element are implanted with light to anneal the region, the light having an emission intensity distribution, a maximum point of the distribution existing in a wavelength region of not more than 600 nm.

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T. Watabiki “Decision of Dismissal of Amendment,” mailed by the Japanese Patent Office on Jun. 7, 2005 in counterpart Japanese Application No. 2001-113570.

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