Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-10-17
2006-10-17
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S737000, C257S778000, C257S789000, C257S793000, C257SE23021, C228S180220, C438S613000
Reexamination Certificate
active
07122896
ABSTRACT:
To provide a low cost mounting structure of an electronic component and to increase the reliability of the conductive connection between a bump electrode and a terminal formed on a substrate, in the mounting structure of the electronic component, the bump electrode includes a core composed of an inner resin and a conductive film covering the surface of the core. The bump electrode is brought into conductive contact with the terminal directly and is elastically deformed to make contact with the face of the substrate in a planar manner. A sealing resin is filled in around the conductive contact portion between the bump electrode and the terminal to hold the bump electrode and the terminal.
REFERENCES:
patent: 5017420 (1991-05-01), Marikar et al.
patent: 5431328 (1995-07-01), Chang et al.
patent: 5477087 (1995-12-01), Kawakita et al.
patent: 5861661 (1999-01-01), Tang et al.
patent: 5925930 (1999-07-01), Farnworth et al.
patent: 5956235 (1999-09-01), Kresge et al.
patent: 6063647 (2000-05-01), Chen et al.
patent: 6073829 (2000-06-01), Pienimaa
patent: 1-158743 (1989-06-01), None
patent: 4-315137 (1992-11-01), None
patent: A 5-182516 (1993-07-01), None
patent: A-09-293753 (1997-11-01), None
patent: A-10-173006 (1998-06-01), None
patent: 2001-217268 (2001-08-01), None
patent: A-2002-043558 (2002-02-01), None
patent: A-2002-134541 (2002-05-01), None
Saito Atsushi
Tanaka Shuichi
Clark Jasmine
Oliff & Berridg,e PLC
Seiko Epson Corporation
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