Polymers, resist compositions and patterning process

Details Polymers, resist compositions and patterning process Polymers, resist compositions and patterning process

2006-10-24

2006-10-24

Ashton, Rosemary (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S326000, C526S243000, C526S287000, C528S391000

Reexamination Certificate

active

07125641

ABSTRACT:
A polymer comprising recurring units of (1a) or (1b) wherein R1is an acid labile group, adhesive group or fluoroalkyl, R2is H, F, alkyl or fluoroalkyl, R3and R4each are a single bond, alkylene or fluoroalkylene, R5is H or an acid labile group, “a” is 1 or 2, 0<U11<1 and 0<U12<1 and having a Mw of 1,000–500,000 is used as a base resin to formulate a resist composition which is sensitive to high-energy radiation, maintains high transparency at a wavelength of up to 200 nm, and has improved alkali dissolution contrast and plasma etching resistance.

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SPIE 2001, Proceedings 4345-31, “Polymer design for 157 nm chemically amplified resists”, Hiroshi Ito et al.

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