Method of protecting a seed layer for electroplating

Details Method of protecting a seed layer for electroplating Method of protecting a seed layer for electroplating

2006-06-13

2006-06-13

Nguyen, Thanh (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S678000, C438S637000, C438S638000, C438S640000

Reexamination Certificate

active

07060617

ABSTRACT:
The present invention includes a method of providing a substrate; sequentially forming a seed layer over the substrate and forming a protection layer over the seed layer; and sequentially removing the protection layer and forming a conductor over the seed layer. The present invention further includes a structure having a substrate, the substrate having a device; an insulator disposed over the substrate, the insulator having an opening, the opening disposed over the device; a barrier layer disposed over the opening; a seed layer disposed over the barrier layer; and a protection layer disposed over the seed layer.

REFERENCES:
patent: 4420385 (1983-12-01), Hartsough
patent: 5637442 (1997-06-01), Bhatt et al.
patent: 5773198 (1998-06-01), Swirbel et al.
patent: 5824599 (1998-10-01), Schacham-Diamand et al.
patent: 5854513 (1998-12-01), Kim
patent: 6140027 (2000-10-01), Baik et al.
patent: 6140234 (2000-10-01), Uzoh et al.
patent: 6171730 (2001-01-01), Kuroda et al.
patent: 6407145 (2002-06-01), Muller
patent: 6503693 (2003-01-01), Mohondro et al.
Junhwan Oh et al., “Plasma pretreatment of the Cu seed layer surface in Cu electroplating” Materials Chemistry and Physics 73 (2002), pp. 227-234, Elsevier Science B.V.
J.P. Lu et al., “Understanding and Eliminating Defects in Electroplated Cu Films” Proceedings of the IEEE 2001 International Interconnect Technology Conference, Jun. 4-6, 2001, Burlingname, CA, pp. 280-282.

Affiliated with

Also associated with

Rating

Method of protecting a seed layer for electroplating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of protecting a seed layer for electroplating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of protecting a seed layer for electroplating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3682573