Resist resin

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S281100, C430S286100, C430S313000, C430S320000, C430S322000, C430S325000, C430S905000

Reexamination Certificate

active

07063932

ABSTRACT:
According to the present invention, a resist resin having in its structure a specific bridged-bond-containing aliphatic ring, and a resist composition comprising the same are provided. By using this resist composition, a resist pattern excellent in both transparency against short-wavelength light and dry-etching resistance can be formed by alkali development with high resolution.

REFERENCES:
patent: 4018767 (1977-04-01), Buyniski et al.
patent: 4166915 (1979-09-01), Bucholz
patent: 6013416 (2000-01-01), Nozaki et al.
patent: 6027856 (2000-02-01), Nozaki et al.
patent: 6280897 (2001-08-01), Asakawa et al.
patent: 6303266 (2001-10-01), Okino et al.
patent: 6440636 (2002-08-01), Ushirogouchi et al.
patent: 6512067 (2003-01-01), Nishi et al.
patent: 6541597 (2003-04-01), Okino et al.
patent: 6660450 (2003-12-01), Okino et al.
patent: 6692889 (2004-02-01), Funaki et al.
patent: 6824957 (2004-11-01), Okino et al.
patent: 2005/0031990 (2005-02-01), Okino et al.
patent: 2005/0037283 (2005-02-01), Okino et al.
patent: 2005/0037284 (2005-02-01), Okino et al.
patent: 2005/0048400 (2005-03-01), Okino et al.
patent: 5-127370 (1993-05-01), None
patent: 7-120927 (1995-05-01), None
patent: 08-259626 (1996-10-01), None
patent: 9-73173 (1997-03-01), None
patent: 10-83076 (1998-03-01), None
patent: 10-204128 (1998-08-01), None
patent: 10-204132 (1998-08-01), None
patent: 10-239847 (1998-09-01), None
patent: 10-307400 (1998-11-01), None
patent: 10-312060 (1998-11-01), None
patent: 11-35522 (1999-02-01), None
patent: 11-38628 (1999-02-01), None
patent: 11-109632 (1999-04-01), None
patent: 11-231541 (1999-08-01), None
patent: 11-338148 (1999-12-01), None
patent: 2000-26446 (2000-01-01), None
patent: 2000-122295 (2000-04-01), None
patent: 2000-136165 (2000-05-01), None
patent: 2000-275845 (2000-10-01), None
patent: WO 00/01684 (2000-01-01), None
U.S. Appl. No. 11/056,094, filed Feb. 14,2005, Asakawa et al.
U.S. Appl. No. 10/937,357, filed Sep. 10, 2004, Okino et al.
U.S. Appl. No. 10/937,577, filed Sep. 10, 2004, Okino et al.
U.S. Appl. No. 10/937,832, filed Sep. 10, 2004, Okino et al.
U.S. Appl. No. 10/937,313, filed Sep. 10, 2004, Okino et al.
U.S. Appl. No. 10/937,853, filed Sep. 10, 2004, Okino et al.
J. H. Liu, et al., Makromol. Chem., Rapid Commun., vol. 3, No. 4, pp. 215-216, “Synthesis and Polymerization of a Chiral Methacrylate Derivative Containing an Oxobornyl Group”, Jan. 22, 1982.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Resist resin does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resist resin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resist resin will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3674997

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.