Method for providing a redistribution metal layer in an...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S840000, C029S846000, C257S637000, C438S108000

Reexamination Certificate

active

07096581

ABSTRACT:
An integrated circuit includes a portion having at least one active circuit area. The integrated circuit also includes a redistribution metal layer fabricated at least partially during fabrication of the portion of the integrated circuit. A method for fabricating an integrated circuit includes fabricating a portion of the integrated circuit, where the portion includes at least one active circuit area. The method also includes fabricating a redistribution metal layer at least partially during fabrication of the portion of the integrated circuit.

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patent: 4990464 (1991-02-01), Baumgart et al.
patent: 5306936 (1994-04-01), Goto
patent: 6180445 (2001-01-01), Tsai
patent: 6232662 (2001-05-01), Saran
patent: 6262438 (2001-07-01), Yamazaki et al.
patent: 6407002 (2002-06-01), Lin et al.
patent: 6441467 (2002-08-01), Toyosawa et al.
patent: 6551856 (2003-04-01), Lee

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