Semiconductor structure having a compensated resistance in...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S344000, C257S492000, C257S493000

Reexamination Certificate

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07148539

ABSTRACT:
A semiconductor structure includes a substrate, a source area formed in the substrate and a drain area formed in the substrate and comprising a doping of a first conductivity type. The drain area includes a first drain portion with a first doping concentration and a second drain portion with a second doping concentration, wherein the first doping concentration is higher than the second doping concentration. In the second drain portion a first region is formed comprising a doping of a second conductivity type which is different to the first conductivity type. Further, a second region is formed in the substrate below the second drain portion comprising a doping of the first conductivity type. A channel area is provided in the substrate between the source area and the second drain portion.

REFERENCES:
patent: 6207994 (2001-03-01), Rumennik et al.
patent: 6756636 (2004-06-01), Onishi et al.
Gebara, Edward, Niklas Rorsman, Jörgen Olsson, Herbert Zirath, Klas Håkan Eklund, “Output Power Characteristics of High Voltage LDMOS Transistors,” Proceedings of the 5thSymposium on Gigahertz Electronics, Goeteborg, Sweden, Mar. 2000, pp. 75-78, (4 pages).
Disney, D. R., A. K. Paul, M. Darwish, R. Basecki, V. Rumennik, “A New 800V Lateral MOSFET With Dual Conduction Paths,” Proceedings of the 13thInternational Symposium on Power Semiconductor Devices & ICs, Osaka, Japan, Jun. 2001, pp. 399-402, (4 pages).
Cai, Jun, Changhong Ren, N. Balasubramanian, Johnny K. O. Sin, “A Novel High Performance Stacked LDD RF LDMOSFET,” IEEE Electron Device Letters, vol. 22, No. 5, May 2001, (3 pages).
Söderbärg, A., B. Edholm, J. Olsson, F. Masszi and K. H. Eklund, “Integration of a Novel High-Voltage Giga-Hertz DMOS Transistor into a Standard CMOS Process,” IEEE, 1995, pp. 38.5.1-38.5.4, (4 pages).

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