Enhanced sampling methodology for semiconductor processing

Details Enhanced sampling methodology for semiconductor processing Enhanced sampling methodology for semiconductor processing

2006-02-14

2006-02-14

Karlsen, Ernest (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C716S030000

Reexamination Certificate

active

06998867

ABSTRACT:
The present invention improves wafer sampling methods by partitioning a semiconductor wafer into a set of sampling regions and calculating yield of a sampling region(s) of the semiconductor wafer.

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patent: 6367040 (2002-04-01), Ott et al.
patent: 6707936 (2004-03-01), Winter et al.
patent: 6885950 (2005-04-01), Mitsutake et al.

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