Soldermask opening to prevent delamination

Details Soldermask opening to prevent delamination Soldermask opening to prevent delamination

2006-08-08

2006-08-08

Pert, Evan (Department: 2826)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

Reexamination Certificate

active

07088590

ABSTRACT:
A multilayer circuit board includes a base layer, a conductive layer and a soldermask. The soldermask layer has two sets of openings. One of the openings are vent openings, that expose the base layer to provide ventilation so that gases may escape during processing. The second openings expose selective regions of a conductor layer. The multi-layer circuit board provides for less occurrences of delamination.

REFERENCES:
patent: 4801069 (1989-01-01), Ankrom et al.
patent: 4840305 (1989-06-01), Ankrom et al.
patent: 4847446 (1989-07-01), King et al.
patent: 4912020 (1990-03-01), King et al.
patent: 5214845 (1993-06-01), King et al.
patent: 5519580 (1996-05-01), Natarajan et al.
patent: 5593080 (1997-01-01), Teshima et al.
patent: 5617990 (1997-04-01), Thompson, Sr.
patent: 5704535 (1998-01-01), Thompson, Sr.
patent: 5724720 (1998-03-01), Tuttle
patent: 5739585 (1998-04-01), Akram et al.
patent: 5759737 (1998-06-01), Feilchenfeld et al.
patent: 5776824 (1998-07-01), Farnworth et al.
patent: 5796590 (1998-08-01), Klein
patent: 5851899 (1998-12-01), Weigand
patent: 5852870 (1998-12-01), Freyman et al.
patent: 5872338 (1999-02-01), Lan et al.
patent: 5900273 (1999-05-01), Rasmussen et al.
patent: 5915749 (1999-06-01), Baldwin
patent: 5930889 (1999-08-01), Klein
patent: 5945729 (1999-08-01), Stroupe
patent: 5949141 (1999-09-01), Farnworth et al.
patent: 5981314 (1999-11-01), Glenn et al.
patent: 6069028 (2000-05-01), Stroupe
patent: 6084297 (2000-07-01), Brooks et al.
patent: 6085962 (2000-07-01), Jacobson et al.
patent: 6124637 (2000-09-01), Freyman et al.
patent: 6150193 (2000-11-01), Glenn
patent: 6356452 (2002-03-01), Rumsey
patent: 6378199 (2002-04-01), Yoshinuma et al.
patent: 6509278 (2003-01-01), Chen
patent: 6671182 (2003-12-01), Rumsey

Affiliated with

Also associated with

Rating

Soldermask opening to prevent delamination does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldermask opening to prevent delamination, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldermask opening to prevent delamination will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3669076